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Wednesday, June 28, 2017
Embedded MRAM Can Take the Heat
A Globaldoundries technical paper outlines how it addressed a fundamental hurdle for eMRAM, making it feasible for broader uses including automotive MCUs and SoCs.
from EETimes: http://www.eetimes.com/document.asp?doc_id=1331958&_mc=RSS_EET_EDT
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